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| 4-Channel ESD/EMI Filter Array Plus 4-Channel ESD Array for USB CSPEMI307A Features * * * * * * Four channels of combined EMI/RFI filtering + ESD protection Four additional channels of ESD-only protection EMI/ESD channels provide greater than 32dB attenuation at 1GHz 15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on all channels (HBM) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Product Description The CSPEMI307A is a multichannel EMI/ESD array offering a combination of four low-pass filter + ESD channels to reduce EMI/RFI emissions on a data port and four dedicated ESD-only channels intended specifically for ESD protection on a USB port. Each EMI/RFI channel integrates a high quality pi-style filter (C-R-C) which provides greater than 30dB attenuation in the 800-2700 MHz range. These pistyle filters support bidirectional filtering, controlling EMI both to and from a data port connector. The CSPEMI307A provides a high-level of ESD protection on all eight channels for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of 15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 30kV. The CSPEMI307A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CSPEMI307A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. * * Applications * * * * * * * EMI filtering and ESD protection for both data and I/O ports Outer 4 channels provide ESD protection for USB lines and other I/O port applications Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs (c)2010 SCILLC. All rights reserved. May 2010 Rev. 2 Publication Order Number: CSPEMI307A/D CSPEMI307A Electrical Schematic Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 2 of 12 | www.onsemi.com CSPEMI307A PIN DESCRIPTIONS PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME ESD_1 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_2 GND ESD_3 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_4 DESCRIPTION ESD Channel 1 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 2 Device Ground ESD Channel 3 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 15 Lead-free Finish Ordering Part 1 Number CSPEMI307AG 2 Package CSP Ordering Part 1 Number CSPEMI307A Part Marking 307A Part Marking 307A Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 3 of 12 | www.onsemi.com CSPEMI307A Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 600 UNITS C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C Rev. 2 | Page 4 of 12 | www.onsemi.com CSPEMI307A ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL R C TCR TCC VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Temperature Coefficient of Resistance Temperature Coefficient of Capacitance Diode Voltage (reverse bias) Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50, ZLOAD = 50 CONDITIONS MIN 80 TYP 100 30 1200 MAX 120 36 UNITS pF ppm/ C ppm/ C V At 2.5V DC 24 At 2.5V DC IDIODE=10A VDIODE=3.3V ILOAD = 10mA 5.6 -0.4 Notes 2 and 4 5.5 -300 100 nA 6.8 -0.8 9.0 -1.5 V V VESD 30 15 Notes 2,3 and 4 +10 -5 R = 100, C = 30pF 64 kV kV VCL V V MHz fC Note 1: TA=25 unless otherwise specified. C Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: Unused pins are left open. Rev. 2 | Page 5 of 12 | www.onsemi.com CSPEMI307A Performance Information Typical Filter Performance (TA=25 DC Bias=0V, 50 Ohm Environment) C, Figure 1. Insertion Loss VS. Frequency (A2-C2 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) Rev. 2 | Page 6 of 12 | www.onsemi.com CSPEMI307A Performance Information Typical Filter Performance (TA=25 DC Bias=0V, 50 Ohm Environment) C, Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2) Figure 4. Insertion Loss VS. Frequency (A5-C5 to GND B2) Rev. 2 | Page 7 of 12 | www.onsemi.com CSPEMI307A Performance Information Typical Filter Performance (TA=25 50 Ohm Environment) C, Figure 5. Comparison of Filter Response Curves for CSPEMI307A VS. DC Bias Rev. 2 | Page 8 of 12 | www.onsemi.com CSPEMI307A Performance Information (cont'd) Figure 6. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25 C) Figure 7. Resistance vs. Temperature (normalized to resistance at 25C) Rev. 2 | Page 9 of 12 | www.onsemi.com CSPEMI307A Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260 C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 10 of 12 | www.onsemi.com CSPEMI307A Mechanical Details CSP Mechanical Specifications The CSPEMI307A is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Bumps Dim Millimeters Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Custom CSP 15 B3 Inches Nom Max 2.915 2.960 3.005 0.1148 0.1165 0.1183 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.561 0.605 0.649 0.0221 0.0238 0.0256 0.355 0.380 0.405 0.0140 0.0150 0.0160 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS Package Dimensions for CSPEMI307A Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 2 | Page 11 of 12 | www.onsemi.com CSPEMI307A CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74 PART NUMBER CSPEMI307A CHIP SIZE (mm) 2.96 X 1.33 X 0.605 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm Figure 11. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION FULFILLMENT: LITERATURE FULFILLMENT Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: Phone 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: Fax 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: Email orderlit@onsemi.com Support: N. American Technical Support 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative Rev. 2 | Page 12 of 12 | www.onsemi.com |
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